CAS NO:7621-86-5 APBIA/2-(4-Aminophenyl)-1H-benzimidazol-5-amine

APBIA contains a rigid conjugated benzimidazole ring. When introduced as a diamine monomer into the polyimide main chain, it can significantly enhance the material's heat resistance temperature, mechanical strength, dimensional stability, and reduce the thermal expansion coefficient.

At the same time, it endows the film with excellent adhesion, hydrolytic resistance and insulation properties. It is the core monomer for preparing colorless transparent CPI films and high-temperature resistant PI substrates, and is suitable for the demanding conditions of high-end electronics and new energy.

1. Flexible electronics: CPI colorless polyimide film, FPC flexible circuit board substrate, chip insulation layer
2. Optical display industry: OLED/LCD optical film, cover CPI film, high-transparency and high-temperature-resistant optical substrate
3. New energy industry: Modified lithium battery separator, aerogel, battery insulation polymer material
4. Aerospace industry: High-temperature-resistant structural polyimide composite material, aerospace heat insulation film
5. High-performance polymer industry: High-temperature-resistant PI resin, polyimide fiber, special engineering plastic intermediates

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