CAS NO:2420-87-3 BPDA/3,3',4,4'-Biphenyltetracarboxylic Dianhydride

Molecular Formula:C16H6O6
Molecular weight:294.22
Application:It is used to synthesize high-performance polyimide (PI), and is widely applied in flexible displays, FPC circuit boards, microelectronics, new energy, aerospace and other fields as high-temperature resistant film materials.

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Description

Technical Parameters

Products Description

BPDA has low dielectric property, high heat resistance (Tg > 260℃), low thermal expansion and high rigidity.

It is white to off-white crystalline powder with rigid biphenyl backbone. Polyimide copolymerized from BPDA features outstanding heat resistance, low CTE, high tensile strength, good dimensional stability and low dielectric loss, with excellent hydrolysis and radiation resistance.

It is a classic dianhydride monomer for high-modulus PI films, commonly copolymerized with diamines such as APBIA and ODA for CPI transparent films and high-temperature PI substrates for advanced electronics.

Products Specification

Product name	BPDA/3,3',4,4'-Biphenyltetracarboxylic dianhydride
CAS NO	2420-87-3
ITEM NO	M283
Appearance	White to off-white powder
Purity	≥99%
Loss on drying	≤0.5%
Melting point	298 ~ 302
Package	100g/1kg/100kg etc.
Delivery	5-8days
Storage	room temperature
MSDS/COA/TDS	Connect us

Products Application

1. Advanced semiconductor packaging: Photo-sensitive PI (PSPI), RDL (Re-Route Layer), Stress Buffer Layer, AI Chip Insulation Layer

2. Flexible display: OLED Flexible Substrate, CPI Transparent Cover Plate, Foldable Screen Substrate

3. High-end PI films: FPC Flexible Circuit, 5G High Frequency Baseplate, Aerospace Thermal Insulation/Structural Components

4. Others: Medical Materials, Gas Separation Membrane, COFs Materials

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FAQ

Q: How to store BPDA?

A: Keep sealed, dry and away from light. Prevent moisture, it hydrolyzes into acid which will affect polymerization viscosity.

Q: What is the most prominent feature of PI made from BPDA?

A: Low coefficient of thermal expansion, high modulus and good hydrolysis resistance; the film resists thermal deformation.

Q: Is BPDA suitable for high-frequency high-speed substrates?

A: Yes, BPDA-based PI has low dielectric loss, ideal for high-frequency high-speed electronic substrates.

Q: What are the advantages of copolymerization of BPDA and APBIA?

A: BPDA (dianhydride) + APBIA (diamine) produce PI with low CTE, high heat resistance and high transmittance, which is a popular formula for CPI colorless films.

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