CAS NO:62929-02-6 Polyimide Resin

CAS NO:62929-02-6 Polyimide Resin

CAS NO:62929-02-6 POLYIMIDE RESIN
Molecular formula:C35H28N2O7
Molecular weight : 588.60
key characteristics:POLYIMIDE RESIN Used in industries such as aerospace, electronics and electrical engineering, automotive industry, healthcare, and high-end composite materials.
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Description
Technical Parameters

Product Specification

 

Product name

POLYIMIDE RESIN

CAS NO

62929-02-6

ITEM NO

M62929026

Melting point

>300°C

Tg

>260°C

Flash point

>93°(199°F)

Density

1.2

Package

100g/1kg/25kg

Delivery

2-3days

Storage

20-25°C

MSDS/COA

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FAQ

 

What are the core performance advantages of polyimide resin(CAS62929-02-6)?

The core performance advantages include extremely high heat resistance, stability across the entire temperature range, high strength and rigidity with precise dimensions, low loss and high insulation at high frequencies, resistance to strong corrosion and self-extinguishing fire retardancy. All these features are combined and suitable for extreme working conditions, making them the core characteristics of high-end engineering materials.

What is the key reason for using polyimide resin(CAS62929-02-6) in the insulation of new energy battery packs?

1. Thermal runaway protection and heat spread interruption
2. Lightweighting and structural compatibility
3. Insulation fire resistance and chemical stability

What are the key reasons for using polyimide resin(CAS62929-02-6)in the bipolar plate coating of fuel cells?

1. Corrosion resistance and interface protection
2. Hydrophobicity and anti-blocking as well as structural stability
3. Low contact resistance and conductive compatibility
4. Cost and process compatibility

Why can polyimide resin become the core material for flexible circuit boards and 5G antenna substrates in the electronic and electrical fields?

It is because the three core characteristics of high-frequency and low-loss electrical performance, stable flexibility and rigidity across the entire temperature range, and extremely high-temperature resistance in thermal properties perfectly match the precision, high-frequency, miniaturization, and resistance to harsh conditions requirements of these two types of devices. At the same time, it also has additional advantages such as lightweight, corrosion-resistant insulation, and stable size, which perfectly solve the performance shortcomings of traditional substrates (epoxy resin, polyester) in high-frequency, flexible, and high-temperature conditions.

How does the low thermal expansion coefficient of polyimide resin ensure the dimensional stability of precision components under high and low temperature conditions?

The low thermal expansion coefficient of polyimide resin (CTE ≈ 20 - 30 ppm/℃) achieves dimensional stability of precision components under high and low temperature conditions through three effects: matching the thermal expansion characteristics of the substrate, suppressing thermal deformation, and maintaining structural rigidity. It eliminates dimensional deviations under high and low temperature conditions at the molecular and structural levels, precisely ensuring the dimensional stability of precision components.

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