CAS NO:32435-46-4 BMEP/Bis(2-methacryloxyethyl) Phosphate

CAS NO:32435-46-4 BMEP/Bis(2-methacryloxyethyl) Phosphate

Molecular Formula:C12H19O8P
Molecular weight:322.25
Application:Used as a bonding promoter and crosslinking monomer in ultraviolet coatings, inks and adhesives, as well as for the synthesis of resins, dental self-etching primers, medical polymers and reactive flame-retardant materials.
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Description
Technical Parameters

 

Products Description

 

Strong adhesion to tooth, metal, glass and ceramic via phosphate group.

High UV‑curing reactivity and high cross‑link density with dual double‑bond structure.

Good compatibility with various acrylate monomers.

In‑built phosphorus element brings partial flame‑retardant property.

Improves long‑term bonding durability for dental formulations.

 

 

Products  Specification

Product name BMEP/Bis(2-methacryloxyethyl) phosphate
CAS NO 32435-46-4
ITEM NO M344
Appearance Transparent liquid
Purity 98%
Color ≤ 35
Acid Value, mgKOH/g 235-270
Phosphoric acid, wt% ≤ 3.00%
Viscosity, mPa·s @25°C 500 - 730
Density, g/ml @25°C 1.230 - 1.260
Refractive Index @25°C 1.4600 - 1.4700
Moisture, wt% ≤ 0.2%
MEHQ, ppm 200 - 500
Package 100g/1kg/10kg etc.
Delivery 2-3days
Storage 2-8°C
MSDS/COA/TDS Connect us

 

Products Application

 

1.Dental new‑material industry :Raw material for self‑etch dental adhesives and dentin primer, improve bonding strength between resin and tooth tissue.

2.UV‑curing industry:UV coatings, UV inks, vacuum‑plating primer, used as adhesion‑promoting monomer for metal, glass and ceramic substrates.

product-1000-735

3.Adhesive industry:Special UV‑curable adhesives for cross‑link modification and better water‑humidity resistance.

4.Polymer new‑material:Reactive flame‑retardant modifier, raw material for 3D‑printing resin and hydrogel synthesis.

product-700-700

 

FAQ

 

Q: Could BMEP be directly used as dental bonding glue?

A: No. It is raw monomer, must be formulated with other monomers and photoinitiators, cannot apply on teeth alone.

Q: What substrates can it improve adhesion for?

A: It performs best on tooth, metal, glass and ceramic substrates.

Q: Besides adhesion, what other properties can it bring?

A: It participates in cross‑linking curing and brings phosphorus element for partial flame‑retardant performance.

Q: Could you provide COA?

A: Yes, the COA can be supplied with shipment.

Q: What will high moisture content cause?

A: Excess moisture may trigger hydrolysis, weaken product performance and disturb resin curing effect.

 

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